Embedded Boards, Modules, and Systems
by Dan Mandell, with Chris Rommel, June 2019

What questions are addressed?


• Who leads the markets for embedded boards, modules, and integrated computer systems?


• How will form factor fragmentation evolve and impact competition in the future?


• Where are boards and systems providers expanding their developer and application support?


• Why are some market leaders at risk of losing their positioning?


• Which industries face the most competition from captive/OEM in-house engineering solutions?


• What do engineers and developers care most about the embedded hardware they are sourcing?



Vendors Listed in this Report
AAEON Technology, Abaco Systems, ADLINK Technology, Advantech, Artesyn, Avalue Technology, Axiomtek, BAE Systems, congatec, Curtiss-Wright Defense Solutions, Dell Technologies, DFI, Eurotech, EVOC Intelligent Technology, Extreme Engineering Solutions, Fujitsu Technology Solutions, Gemalto, General Dynamics Mission Systems, HPE, Huawei, IBASE Technology, IBM, IEI Integration, Kontron S&T, L3 Technologies, Lenovo, Leonardo DRS, Mercury Computer Systems, MPL, Murata, National Instruments, Octagon Systems, Oracle, Radisys, Rockwell Automation, RTD Embedded, Shenzhen NORCO Intelligent Technology, Sierra Wireless, SIMCom, Supermicro, Skyworks Solutions, Telit, Texas Instruments, Trimble, TYAN, U-blox, VersaLogic, VIA Technologies, WINSystems