Embedded Modules: Bundling Value in Compact Packages
by Dan Mandell, with Chris Rommel, June 2017
What questions are addressed?
- Who leads the markets for COMs and wireless modules?
- What are the key vectors for differentiation of embedded module products?
- Where are different module types being shipped, and what is influencing broader adoption?
- How will various module form factors perform through the next several years?
- Why are more engineering teams increasing their use of embedded modules?
- Which connectivity technologies will see the greatest uptick in support by wireless modules?
Vendors Listed in this Report
MSC Technologies (Avnet),
PFU Systems Limited,