Embedded Modules: Bundling Value in Compact Packages

by Dan Mandell, with Chris Rommel, June 2017

What questions are addressed?

  • Who leads the markets for COMs and wireless modules?
  • What are the key vectors for differentiation of embedded module products?
  • Where are different module types being shipped, and what is influencing broader adoption?
  • How will various module form factors perform through the next several years?
  • Why are more engineering teams increasing their use of embedded modules?
  • Which connectivity technologies will see the greatest uptick in support by wireless modules?

Vendors Listed in this Report

Abaco Systems, Actis Computer, ADLINK Technology, Advantech, congatec, DFI, Gemalto, Huawei, IBASE Technology, Kontron, Laird, Libelium, Link Labs, MEN Mikro, Microchip, MSC Technologies (Avnet), Murata Manufacturing, NORCO, PFU Systems Limited, Portwell, Radisys, SECO, Semtech, Sierra Wireless, SIMCom, Skyworks Solutions, Telit, Texas Instruments, Trimble, u-blox, ZTEWelink

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